ESC San Jose, Ca. ” ADLINK Technology Inc. Embedded Systems Conference to announce what it claims is the biggest architectural innovation in small form factor (SFF) rugged single board computers (SBCs) since the PC/104 bus was invented by Ampro in 1992.
According to Colin McCracken, product director for ADLINK's embedded computer division, the new CoreModule 730 embedded processor, based on the ultra low power Intel Atom Z510 and Z530 processors at 1.1 and 1.6 GHz, respectively, sets a new efficiency standard for tiny rugged computers by using the new SUMIT expansion interface.
“It reinvents stackable and mezzanine architectures by packing an enormous amount of data bandwidth and easy connectivity,” he said, “including multiple PCI Express lanes, USB 2.0 interfaces, LPC bus, I2C bus, and SPI bus ” into a fraction of the space previously occupied by only the 33 MHz parallel PCI-104 bus.”
With PCI Express, Gigabit Ethernet, USB 2.0 ports, and a Compact Flash socket, he said, the CoreModule 730 features the lowest-power Intel chipset available, the US15W “Poulsbo” chipset, to round out the “Menlow” platform at only 5 W for 1.1 GHz.
Conductive cooled solutions are also easy to implement for small sealed boxes with no internal air flow. This announcement means that system OEMs in military, avionics, transportation, data logging, portable computing and other rugged markets can add a state-of-the-art Intel Architecture controller to their systems without a custom carrier board design.
“While many board manufacturers require their system OEM customers to design custom carriers or use two-board solutions in order to take advantage of their Atom-based computer-on-module (COM) products,” he said, offering the CoreModule 730 as a “true single-board solution, ready to run with simple cables,”
He said that by departing from space-inefficient pin-in-socket expansion with parallel buses, CoreModule 730 will bring stackable SBCs into new application areas.
SUMIT is the new standard expansion interface from the Small Form Factor Special Interest Group (SFF-SIG) at www-sff-sig.org.
ISM stands for Industry Standard Module, and is a 90x96mm form factor that specifies a board outline and mounting holes and is completely flexible in terms of expansion interfaces.
ISM is also defined by the SFF-SIG. CoreModule 730 offers a choice of 1.1 GHz and 1.6 GHz Atom processors, US15W chipset, DDR2 533 SODIMM RAM up to 2 GB, Gigabit Ethernet, four USB 2.0 ports, IDE interface, Compact Flash socket, 8 general-purpose I/O pins (GPIOs), and integrated graphics engine with H.264 decode acceleration, analog VGA output and 18-bit / 24-bit LVDS interface for LCD displays.
The CoreModule 730 SBC starts at around $400 in OEM quantities and will be sampling within 30 days. To learn more, go to www.adlink.com