LONDON Diamond Systems Corp. (Mountain View, Calif.) says that a group of companies involved with board-level embedded computing market will jointly launch a new embedded system expansion standard at Embedded World in Nuremberg, Germany on Mar 2.
The mezzanine-style standard, originated by Diamond, defines a compact, lower cost way to add application-oriented capabilities to single-board computers (SBCs), computer-on-module (COM) baseboards, and fully-custom embedded electronics.
Diamond Systems expects this embedded I/O expansion standard to be adopted rapidly throughout the board-level embedded market, because it fills a need that cannot be addressed by stackable expansion standards such as the numerous PC/104, SUMIT, and ITX form-factor variants.
It is said to be synergistic, not competitive, with those standards, as well as with various computer-on-module approaches such as COM Express and Qseven.
The standard leverages the latest high-speed serial expansion standards and is suitable for use with both x86 and RISC architecture host processors.
Following its initial public announcement and demonstration, Diamond intends to transfer ownership of the embedded I/O expansion standard — including its specifications, trademark, and logo — to a suitable standards organization.
Then the standard will be usable by anyone without charge; however, rights to use of the logo in association with products will be restricted to members of its parent organization.
“This new I/O expansion standard satisfies the desire of customers to be able to add application-specific capabilities to SBCs and COM baseboards without adding height to the system,” said Jonathan Miller, founder and president of Diamond Systems.
Colin McCracken, Diamond's VP of marketing and co-creator of the SUMIT standard , added that the new standard “passes along to system OEMs and end users the substantial benefits of size, weight, and power savings resulting from Moore's Law.”
Rick Lehrbaum, Strategic Development Specialist at Diamond and author of the original PC/104 specification, claimed, “It represents the most significant embedded system expansion Innovation since the birth of PC/104 in 1992.”
According to Diamond, several companies will demonstrate products compatible with the new standard at Embedded World 2010. Products demonstrated will include I/O expansion modules based on the standard and both single-board computers and application baseboards having sockets for the modules.
The New Standard Compact, low profile form-factor is three-fifths the size of a credit card, and one-third the size of a PC/104 module.
A single low-cost connector integrates all host and external I/O interfaces and provides up to 100 I/O points per module. Multiple I/O expansion modules may be present within one system.
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