LONDON The National Physical Laboratory is to host the second Electrically Conductive Adhesives Workshop which will draw on data from the DTI funded project by NPL & TWI with the aim to develop test methods for determining the reliability of conductive adhesives (CAs).
On the 13 December new data will be presented on joint geometry and coatings, with further complimentary presentations from academia and industry. This workshop is suitable for engineering, production and quality engineers.
The week before on December 8 , a Lead-Free Conference will review and bring together DTI and industry research at NPL across lead-free soldering. The programme will deal with the various issues confronting industry in implementing new technologies, from components through to reliability. The meeting will be relevant to engineers and managers.
Sessions will include lead-free components, design considerations, printing, reflow soldering, solder joint inspection, solder joint reliability and include alternatives to lead-free. A tabletop exhibition will be held during the day.