Octavo Systems announced the most completely integrated 1GHz Arm Cortex A8 computing platform, the OSD335x C-SiP. The OSD335x C-SiP (Complete System-In-Package) integrates the required components for a computing system into a single IC package that is about the size of a standard Lego block. The newest addition to the OSD335x family, the OSD335x C-SiP is a complete system containing the 1GHz Arm Cortex-A8 Sitara AM335x processor from Texas Instruments, up to 1GB of DDR3 RAM, 4KB EEPROM, 2 Power Supplies, up to 16GB of eMMC Non-Volatile Flash Memory, a MEMS Oscillator, and over 100 passive components into its single 27 X 27mm 400 ball BGA package.
Through the integration of OSD335x C-SiP, many of the repetitive and tedious tasks associated with designing a computing system are removed. Things like laying out DDR3 memory interfaces and power sequencing are no longer required. Also, any concerns about EMI caused by the layout of the oscillator are alleviated.
Besides simplifying the design of an embedded system, the OSD335x C-SiP is also about 50% smaller than an equivalent system built with individual components. This allows designers to shrink their designs, save cost on their PCBs, or add processing power to form factors that weren’t possible before.
Suited for a wide range of applications, the OSD335x C-SiP hits the sweet spot of size and performance for Building Automation, to Industrial Control, to Consumers goods, and is especially popular for IoT. The OSD335x C-SiP simplifies the process of sourcing components and managing the supply chain.