Packaging conference looks for papers - Embedded.com

Packaging conference looks for papers

LONDON — The call for papers for the 2009 Association for the Research on Components and Secured Integrated Systems (ARCSIS) Micropackaging Days has been issued and the event has chosen a thin and flexible packaging theme.

The event will take place on Oct. 15 – 16 2009 at the Provence Microelectronics Centre – Georges Charpak in Gardanne, France. It consists of scientific and technical conferences and a poster session presented by experts from Universities, research centres and industry.

The deadline for abstract submission is May 15, 2009 and topics will include:

• Materials and characterization: organic, nanocomposites, flexible substrates.

• Printed electronics: material jet deposition, spray deposition, thermal annealing, printed devices, laser ablation, surface preparation, circuits, interconnections, flexography, real to real processes.

• Smart objects and NFC: display, OLED, energy sources (flexible batteries and flexible photovoltaic), NFC & its packaging.

• Advanced packaging and test: embedded chips, SiP, 3D integration, wafer level packaging, rebuilt wafers, through silicon vias, embedded dies, modelling, simulation, characterization, tests & reliability.

A keynote speach will be given by Dr.Ir. Peter Slikkerveer, who worked for over 10 years on diverse subjects in the material science and processing area at Philips Research Labs in Eindhoven, Netherland. In February 2009 he became Director at MpicoSys – Embedded Pico Systems, a start-up company directed towards consultancy and product development of miniature electronic systems like smartcards with displays.

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