Peratech receives investment to fund expansion -

Peratech receives investment to fund expansion


LONDON — The YFM Group managed Partnership Investment Finance has invested £1.1 million (about $1.7 million) in Peratech Ltd. (Richmond, UK). This will be used for further research and development into the company's patented Quantum Tunnelling Composite (QTC) technology for touch technology solutions and increasing sales into overseas markets.

Peratech recently signed licensing agreements with Nissha and Samsung Electro-mechanics for 3D input technology for mobile phones.

“Peratech’s recently announced license deals with major international companies Nissha and Samsung Electro-mechanics demonstrate how QTC can open up exciting new ways of doing things,” said Mark Winderbank of YFM Group. “We are proud to be able to support a fast growing British company with a truly unique technology that has a tremendous world market. Of all the possible investments that we have looked at recently, Peratech stood out because of the strength of its innovative technology and huge growth potential.”

In the last 12 months 88 companies received funding from YFM Group (Leeds, UK), with the deals being worth more than £89 million (about $140 million). The group is the most active investor in UK SMEs based on research carried out by Private Equity Insight.

“In these financially challenging times, it is a real testament to both the QTC technology and the team behind it to have received funding of this level,” said Philip Taysom, joint CEO of Peratech.

The company has invested significant R&D efforts to understand this new class of material science that it has invented. We are now at the stage where its ability to add value and completely new innovative features, which provide significant commercial advantages, are clearly demonstrable as can be seen from the licensing deals that we are closing with Tier 1 international companies.”

Peratech is the inventor in quantum tunnelling composite (QTC) technology. QTC's are electro-active polymeric materials which enable the action of 'touch' to be translated into an electrical reaction, enabling a vast array of devices to incorporate very thin and highly robust 'sensing' of touch and pressure.


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