SMART Modular Technologies announced its lineup of DDR4-3200 32GB Low Profile industrial Mini-DIMMs. SMART has several new 32GB Mini-DIMMs which include ULP (Ultra Low Profile) and VLP (Very Low Profile) with registered and unbuffered ECC options to meet a wide range of use cases. SMART has been providing Mini-DIMM support for many years, offering customers long-term support as well as a solid roadmap of new higher-density, higher-speed options.
SMART’s DDR4-3200 32GB industrial Mini-DIMMs undergo stringent in-house environmental temperature screening to operate between -40 to +85°C which makes SMART’s DDR4 Mini-DIMMs an ideal solution for telecom and networking equipment being deployed under harsh operating conditions. Customized ruggedizing features can be added, such as conformal coating and anti-sulfur resistors to protect against toxic operating conditions or underfill for excessive vibration, all to allow reliable, long-term system operation.
DDR4 Mini-DIMMs are designed with more power and ground pins compared to SO-DIMMs. Mini-DIMMs are JEDEC-standard, an industry standard which SMART originally helped to develop. The extra power and ground pins ensure robust system operation under harsh conditions. Systems with Mini-DIMMs often go through NEBS compliance testing, ensuring conformance of a network product to the requirements of the Network Equipment Building System (NEBS) standard. Compliance to this standard indicates that a network product or telecommunications equipment performs at its optimum capacity.
SMART’s high-density industrial Mini-DIMM are offered in ULP height (17.78mm) and VLP height (18.75mm) to accommodate a wide variety of system board height requirements. Mini-DIMMs are supported by connectors from Molex and Foxconn, allowing Mini-DIMMs to be either mounted vertically, angled at 22.5°, or at a right angle to the system board.