Processor architecture speeds time-to-market for low-cost, low-power 3D audio, graphics - Embedded.com

Processor architecture speeds time-to-market for low-cost, low-power 3D audio, graphics

LSI Logic has developed a low-power, 3D-capable application processor architecture. Dubbed Zevio, the architecture is suited for consumer electronics products such as GPS navigation systems, electronic toys, and edutainment applications, personal media players, and handheld products.

The Zevio application processor architecture enables the price-power-performance balance consumer electronics manufacturers are looking for. By providing development support tools and pre-verified consumer-specific IP, such as 3D graphics and 3D sound cores, the architecture reduces design complexity and time-to-market.

The flexible architecture has been developed to enable fast time-to-market for either standard product or custom ASIC customers. With a menu of pre-verified IP blocks that are critical to developing consumer electronics products—from ARM and ZSP DSP to video codecs and 3D graphics and 2D/3D sound processors— the Zevio architecture enables products to move from concept to prototype in as little as six months. By utilizing the programmable reference boards and PC emulators, designers can alleviate steps in a complex system design, get a head start on verification and application development, and concentrate on the design and implementation of differentiating product features.

More information is available at www.lsilogic.com. For more information about Zevio application processor partners, visit Koto Co. (www.koto.co.jp), Access Co. (www.access.co.jp/english), or Hi Corp. (www.hicorp.co.jp).

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