Renesas adds MCUs for battery powered applications - Embedded.com

Renesas adds MCUs for battery powered applications

Renesas Electronics has added two 16-bit microcontrollers to its R8C/Lx Series. The R8C/LA3A and LA5A MCUs comprise a total of two groups with 32 pins and 52 pins integrating up to 64 kilobytes  of programmable flash memory.
 
The low-profile quad flat packages (LQFP) with in 32 pins (7mm x 7mm) and 52 pins ( 10mm x 10mm) are suitable for use with liquid crystal displays of up to 24 segments x 4 common.

Segments or IO ports are software selectable by every single port and provide flexible port usability with the smallest pin counts of Renesas Electronics’ family of MCUs with an LCD controller.
 
Use of 1.8V E/W flash memory, including the data flash area and code area, enables users to program the systems in the fields even at the end of the system’s life. The A/D conversion, which is also available from 5.5V down to 1.8V, broadens the operating range, especially for sensor applications.

The R8C/LAxA groups offer special power down modes to minimize power consumption while the system is idle.

The combination of small pin counts and minimum display capability provides users with flexible options and the R8C/LAxA products offer a display capability for applications without an external display controller.
 
The 1.8V E/W flash memory, including the data flash and code flash area, provides EEPROM-like usability. The guaranteed program and erase time is 10,000 times and data is retained for 10 years. The R8C/LAxA groups broaden the A/D conversion voltage range down to 1.8V, enabling both it and the flash memory to be active even when the battery is almost empty.
 
The two power-down modes provide smart power management with reduced overall system power consumption. The CPU and the real time clock (RTC) run with 32 KHz sub clock in power off mode 2, and in the power off mode 0 only the RAM is retained, reducing the standby current consumption to less than 10nA.

The on-chip gain amplifier offers designers a wider dynamic range of A/D conversion with ×1, ×2, ×4, ×6 and ×8 software selectable gains. An on-chip temperature sensor provides flexibility for the calibration of both internal and external components. These two functions further reduce the number of external components required to implement designs.
 
First samples are scheduled to begin in 2Q/2011, with samples of the remaining products being shipped shortly after.

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