ROHM: ultra-compact automotive-grade MOSFETs enable greater miniaturization

ROHM announced the development of ultra-compact 1.6×1.6mm size MOSFETs that deliver superior mounting reliability. The RV4xxx series is AEC-Q101 qualified, ensuring automotive-grade reliability and performance under extreme conditions. ROHM’s original package processing technology enables the miniaturization of automotive components, such as ADAS camera modules, that demand high quality.

In recent years, the growing number of vehicle safety and convenience systems such as ADAS cameras has emphasized the challenge of limited space to accommodate these systems and spurring the demand for smaller components. To meet this need, bottom electrode type MOSFETs that can be miniaturized while maintaining high current are increasingly attracting attention.

However, for automotive applications optical inspection is performed during the assembly process to ensure quality, but in the case of bottom electrode components solder height cannot be verified after mounting, making it difficult to confirm mounting conditions.

ROHM has a proven track record of developing and introducing new products ahead of market trends, and such is the case with the new ultra-compact MOSFETs. This time, ROHM has become the first in the industry to ensure the electrode height on the side of the package (130µm) required for vehicle applications by utilizing original Wettable Flank formation technology. The result is a consistent solder quality – even for bottom electrode type products – enabling automatic inspection machines to easily verify solder conditions after mounting.

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