SECO: a sneak peek at products presented at embedded world -

SECO: a sneak peek at products presented at embedded world


As every year, SECO will be in Nuremberg for the annual Embedded World trade fair. Among the great innovations of this year, the launch of COMe-B75-CT6: it is a COM Express Compact 3.0 Type 6 Module with nothing less than the AMD Ryzen Embedded V1000 processors. The module mounts up to 4 Zen x86 CPU cores with the latest Radeon graphics and I/O controller on a single chip. Ideal for medical devices, digital signage, infotainment, and gaming, it will also be exposed at Keysight Technologies' booth.

Speaking of Intel-based solutions, the vast array of solutions based on Intel Atom E39xx family, Intel Celeron N3350 and Intel Pentium N4200 (c.n. Apollo Lake) SoCs will be exposed: first and foremost, the SM-B69, a high-performance, low-power, feature-rich SMARC Rel. 2.0 compliant module with 4K HW decoding and encoding, and the SBC-B68-eNUC, an industrial x86 embedded NUC SBC perfect for HMI, multimedia devices, IIoT, and industrial automation.

SECO is a member of the exclusive NXP i.MX 8 early access program. The SM-C12, a SMARC Rel. 2.0 compliant module with NXP i.MX 8M Application Processors, is a scalable solution designed by SECO for home automation, transportation, digital signage and vending machines, and applicable to scenarios requiring advanced security, connectivity, multimedia and real-time response. The new Qseven modules based on NXP i.MX 8M (Q7-C25) and NXP i.MX 8 Application Processors (Q7-C26) will also be presented.

Speaking of other NXP-based solutions, one of the great innovations of this year at SECO booth is the new Smart Edge Compute Unit SYS-C23-GW. This industrial IoT multiprotocol gateway, based on NXP i.MX 6SoloX Processor, is a cloud connectivity ready solution, which enables multi-core edge computing and networking. When it comes to connectivity, thanks to the partnerships with Telenor Connexion and Quectel, the board is plentiful, offering 2G/4G, WiFi, BLE/2x Ethernet and SubGiga.

Another innovative achievement in the SECO’s Boxed Solutions product family is the SYS-A90-IPC, a Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon). Designed for high-level graphics performance, it offers three independent heads with UltraHD 4K resolution and h.264/h.265 4K hardware.

Back to the ARM-solutions topic, SM-B71, a SMARC Rel. 2.0 compliant module with the Xilinx Zynq Ultrascale+ MPSoC, will also be featured at SECO’s booth: this product merges ARM and FPGA into a heterogeneous, standard form factor, combining wide scalability, high flexibility, and dedicated Real-Time ARM Cortex-R5 processors.

Also, the new carrier board CCOMe-C30 will be presented: a digital signage-oriented Carrier Board for COM Express Type 6 Modules on 3.5” form factor, offering a wide range of I/Os, multi-display applications and connectivity options.

At SECO Lab, the UDOO team will showcase the UDOO family of Open Source Arduino-powered Mini PCs, including UDOO X86, worldwide acclaimed as “the most powerful maker board ever”. The UDOO team will also demo for the first time its most impressive innovation so far: UDOO IoT Cloud, a web cloud platform designed for IoT, rapid prototyping, and home automation. Different from other platforms, UDOO IoT Cloud stands out for ease of use thanks to the seamless integration with all the UDOO devices as well as with the upcoming UDOO Grove Kit and App Inventor, which ultimately simplifies programming.

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