SECO: COMs and SBCs on display at electronica -

SECO: COMs and SBCs on display at electronica


SECO will display its set of computer-on-modules and single-board computers at electronica 2018. Not only physical products: SECO will also present its services, such as the customisation of computing platforms, software customisation, system integration and assembly, and the “IIoT as a service” software framework to make the customer's business IoT ready.

Most notably, SECO will present the multi-core, scalable solutions based on the NXP i.MX 8 Series Applications Processors for advanced graphics, HMI, IoT and control applications, as well as the industrial solutions based on the Xilinx Zynq Ultrascale+ MPSoCs. All of these solutions are characterised by optimal scalability, advanced graphics performance, as well as exceptional power efficiency. Together they represent SECO's industrial ARM-based standard solution, all sharing the same core aspects: asymmetric multi-core processing, industrial machine vision, 4K video processing and dedicated real-time cores.

Available only within the NXP i.MX 8 Early Access program, NXP i.MX 8 Series Applications Processors represent a major step forward as far as graphics, HMI, IoT, and control applications are concerned. The series has the best in class video performance, supporting 4K resolution, HDR, and Dolby Vision, the best in class audio interfaces, with 20+ audio channels inputs/outputs, scalable next-generation GPU performance and high performance at low power. Compared to the i.MX 6 series, the i.MX 8M series is a revolution both in terms of power, with up to one and a half times the CPU and GPU performance, as well as in terms of energy efficiency, with a power consumption of 3.8 W, 15% less than the i.MX 6 series. The flexibility is also boosted, with new additions such as the M4, and the same goes for the VPU, which supports H265 4kp60 HDR.

With regards to the Qseven form factor, SECO will exhibit the Q7-C25 and the Q7-C26, the former based on NXP i.MX 8M Application Processors, the latter on NXP i.MX 8 Application Processors. Both of the modules deliver high-end graphics, with HEVC decoding in 4Kp60 and full-chip virtualization with HW isolation and separate display paths. Both can drive up to two displays at the same time. Yet, while the Q7-C25 is a scalable solution for domotics and vending scenarios because of its advanced security, connectivity, and multimedia capabilities, the Q7-C26 also features rich M2M interface to control onboard subsystems and an even wider connectivity.

On the SMARC form factor there is the SM-C12 based on NXP i.MX 8M Application Processors. Enabling HEVC/VP9 decoding 4Kp60 and HDR, it provides excellent graphics capabilities. In regard to connectivity, the SM-C12 mounts an embedded Wi-Fi and BLE.

Finally, SECO also proposes a SBC built upon the NXP i.MX 8M Application Processors: SBC-C20, like the aforementioned models, is characterised by HEVC/VP9 decoding in 4Kp60 as well as HDR. As for the memory, it features a DDR3L RAM. Moreover, it provides an optimized IoT stack with preinstalled Wind River Linux 10. The range of connectivity options is particularly broad, with optional Wi-Fi and BT LE 4.2 module, M.2 socket 2 Key B for WWAN modules. Interestingly, it also features a Cortex-M4 for RTOS, the real-time operating system for serving real-time applications that process data as it comes in without buffer delays.

SECO also offers a range of Xilinx-based products, namely the AXIOM board and the SM-B71, built on SMARC. Ultimately, both of these products are heterogeneous processing systems based on the Xilinx Zynq Ultrascale+ MPSoCs, designed for smarter industrial solutions. Interestingly, they provide a wide range of supported Xilinx Zynq Ultrascale+ MPSoC and are fully equipped with multi-Gbps transceivers. Compared to the rest of the market, they stand out thanks to the extraordinary flexibility granted by up to 256k FPGA logic cells. Most notably, the AXIOM board is the result of an EC-funded effort involving seven EU-based players, including universities, research groups and small-medium enterprises, to design and manufacture the ultimate hardware and software platform for cyber-physical systems.

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