First and foremost, the COMe-B75-CT6, a COM Express Compact 3.0 Type 6 Module based on the AMD Ryzen Embedded V1000 processors, will be presented on both the SECO stand and the PICMG stand. Ensuring top performances thanks to the x86 “Zen” Core CPU, it also features an AMD Radeon Vega GPU with up to 11 compute units and support for DirectX 12. As the icing on the cake, it can drive up to 4 independent displays at the same time. When it comes to connectivity, the COMe-B75-CT6 equips 4x USB 3.0, 8x USB 2.0, 4x PCI-e x1 Gen 3 and PEG x8 Gen 3. Finally, the module embeds two DDR4 SO-DIMM slots supporting DDR4-3200 ECC memory. The product is perfect for biomedical and medical devices, digital signage & infotainment and gaming.
On the SECO booth, the COM Express scalability with the latest Intel platforms will be also highlighted. From the new COM Express Compact Type 6 module with the 8th Gen Intel Core U-series processors (COMe-C55-CT6) to the COM Express Basic Type 6 module with the Intel 8th generation Core / Xeon CPUs (COMe-C08-BT6) and the COM Express Compact Type 6 Module based on the Intel Atom X Series, Intel Celeron J / N Series and Intel Pentium N Series processors, this broad range of solutions excels in terms of scalability and flexibility, with support for up to 3 independent 4K Ultra HD displays, industrial temperature range and HW accelerated machine learning through OpenVINO, to fully meet a broad range of market demands and design requirements.