ST and Freescale ready first silicon of jointly developed auto MCUs - Embedded.com

ST and Freescale ready first silicon of jointly developed auto MCUs

NUREMBERG, Germany — Freescale Semiconductor and STMicroelectronics have produced first silicon from their respective wafer fabs in Austin, Texas, and Agrate Brianza (Milan), Italy, for four automotive microcontrollers (MCUs) targeting powertrain, body, instrument cluster and safety/chassis applications.

Manufactured on the two companies’ aligned 90-nanometer embedded-flash technology, the four Power Architecture MCU are initial results from the two companies’ joint design program, initiated two years ago.

“The system-on-chip platform enables us to quickly develop multiple automotive products incorporating optimized peripheral sets and embedded flash memory, fine-tuned for specific automotive applications,” said Denis Griot, chairman of Freescale EMEA and global automotive marketing.

ST and Freescale are extending the aligned product roadmap through ongoing work at joint design centers in Naples, Agrate, Sao Paulo and New Delhi’s National Capital Region. Staffed by more than 150 design engineers, these design centers are focused on developing next-generation MCU products optimized for specific automotive market segments.

Lead automotive customers will receive samples of the jointly developed MCU products throughout Q1 2008. The two companies plan to provide general automotive market product information, pricing and availability for the dual-sourced products later this year.

Leave a Reply

This site uses Akismet to reduce spam. Learn how your comment data is processed.