Making the shift to optical interconnect with PCIe Gen3
The highly anticipated launch 8 Gbps, PCI Express 3.0 (PCIe Gen3) is making its debut, doubling the effective bandwidth and generating the same ubiquity and…
Applications
How capacitive turbosensing reduces noise & signal error in touchscreen apps
This “Product How-To” article focuses how to use a certain product in an embedded system and is written by a company representative. Capacitance measurement, widely…
NEWS: Board expansion standard to debut in Nuremberg
LONDON Diamond Systems Corp. (Mountain View, Calif.) says that a group of companies involved with board-level embedded computing market will jointly launch a new…
IC companies buy in to initiative to reduce skills shortage
LONDON — The UK Electronics Skills Foundation (UKESF) has been set up to address the threat of diminishing skills in the UK electronics sector. The…
Kitron leases manufacturing in China, buys in Germany
LONDON — Scandinavian contract manufacturer Kitron ASA has moved forward in its planned expansion in China as well as lining up a purchase in Germany….
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Survey finds manufacturing moving back to UK
LONDON — A report into the UK manufacturing sector by the EEF and accountants BDO, has found that one in seven companies surveyed had moved…
CANopen specs gets trio of upgrades
LONDON CAN in Automation (CiA) has released three updated standards for CANopen. Version 1.7 of the CiA 303-1 CANopen is a additional specification for…
Growth spurs Tekdata move to new manufacturing base
LONDON Tekdata Interconnections Ltd., will be complete a move in to new manufacturing facilities in Stoke-on-Trent, England, by October 19. The company will increase…
NEC and KPIT Cummins collaborate on AUTOSAR 3.0 solution
LONDON NEC Electronics Corp. and KPIT Cummins have released an AUTOSAR 3.0-compatible software package for a selection of hardware platforms. “We have been continuously…
Doing the Embedded Systems Conference with your feet up
If you are like me, you run yourself to the ragged-edge each time youattend the EmbeddedSystems Conference, trying to rush around in two or three…