Computer-aided engineering, printed circuit board and multi-chip module, semiconductor intellectual property, and services all recorded double digit growth.
Synopsys Cloud will provide access to a suite of cloud-optimized design and verification products with pre-optimized infrastructure on Microsoft Azure, or customers can also bring their own cloud and access the EDA tools.
A roundup of this week’s embedded news includes podcasts featuring interviews with Joe Sawicki of Siemens post- DAC, and a report on the RISC-V Summit plus news of products, funding and people.
Memfault and Silicon Labs improve IoT development and operations with embedded observability, debugging and device diagnostics in the cloud.
Many designers wanted a better integration with their existing desktop CAD tools, so SnapEDA, an online design library for CAD models of electronic parts, launched a desktop app.
A look at how chip manufacturers will have to adjust hardware architecture in order to accommodate ever-growing demand for increased AI functionality.
Imperas simulation models now available within TESSY environment for the automation of embedded software testing and regression management.
Synopsys said DesignWare HBM3 controller, PHY, and verification IP reduces integration risk and maximizes memory performance in multi-die systems.
New platform provides single unified cockpit to help system-level designers plan, implement, and analyze any type of stacked die system to give a full system view and perform system-driven optimization of performance, power, and area (PPA).