Samsung Electronics has announced availability of its newest integrated 2.5D packaging solution, Interposer-Cube4 (I-Cube4), incorporating four high bandwidth memory (HBM) dies and one logic die…
Xilinx has taken a big step towards enabling wider market adoption of edge artificial intelligence (AI) and particularly embedded vision by entering the system on…
With chip design becoming increasingly complex with multiple components and technologies coming together in hyper-convergent integrated circuits (ICs), a single system approach to analyzing the…
Cadence Design Systems has launched its next generation emulation and prototyping systems which it said offer the fastest and highest performance pre-silicon hardware debug and…
RISC-V International and CHIPS Alliance have announced a joint collaboration to update the OmniXtend Cache Coherency specification and protocol, along with building out developer tools for…
With multiple sensors per system and growth in sensor diversity coupled with sensor processing demands and many proprietary APIs, the cost and time needed to…
Building automation systems (BAS) integrate lighting, energy, HVAC, safety, and security into a single intuitive system, balancing the optimum efficiency of the building’s operation with…
There are two basic approaches to designing a multiprotocol wireless system – build the system from the ground up with an RF chip, passives, filters,…
The UART, or universal asynchronous receiver-transmitter, is one of the most used device-to-device communication protocols. This article shows how to use a UART as a…
Today’s cars are essentially networks on wheels, with computers and sophisticated on-board electronic devices running complex software to keep their occupants safe, comfortable, and entertained….
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