While talking about the future of wearable technology, Ralph Osterhout (CEO, The Osterhout Design group) made a crisp and relevant observation: “What won’t work is…
The recently introduced USB 3.1 specification comes with a new connector that finally solves the biggest problems with the original USB spec — the requirement…
The difference between commercial hardware design and hobby electronics has blurred over the last few years. With open source hardware, the newer slate of very…
For the past few weeks I've been chatting to the folks at Makerarm.com about an incredible robot arm called… well, Makerarm. They've been keeping this…
Because of their small size and dimensions, few printed circuit board standards exist for the growing wearable Internet of Things market. Until they emerge, we’ll…
The Fraunhofer Institute for Applied and Integrated Security (AISEC) is developing a very versatile and flexible form of Physically Unclonable Function (PUF), one that can…
Ball grid array (BGA) device packaging is today’s standard for housing a range of highly advanced and complex semiconductor devices like FPGAs and microprocessors. The technology…
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