5G is driving a great deal of the memory requirements in smartphones and advances in processors have been a big driver for higher bandwidth. Smartphone…
Microcontroller (MCU) suppliers are steadily increasing the memory content in their devices, but is that enough to support design needs for AIoT—the intersection of artificial…
Samsung Electronics has announced availability of its newest integrated 2.5D packaging solution, Interposer-Cube4 (I-Cube4), incorporating four high bandwidth memory (HBM) dies and one logic die…
Thermal imaging is used in a wide range of applications, from the manufacturing and processing of industrial products to security and surveillance. Because the wavelengths…
Event data recorders (EDRs), often called black boxes, are not new in automotive electronics. EDRs have been recording data in cars for almost 50 years….
TORONTO—Sometimes a problem can become its own solution. For CEA-Leti scientists, it means that traits of resistive-RAM (ReRAM) devices that have been previously considered as…
Micron Technology has begun sampling what it said is the industry’s first automotive low power DDR5 DRAM (LPDDR5) memory that is hardware-evaluated to meet the…
The global storage market is witnessing a growing demand for NAND flash. This technology has been met through many developments, not only in the capabilities…
TORONTO — Like most new memory or memory interface specifications, the latest iteration of the Universal Flash Storage (UFS) Card Extension Standard unsurprisingly boosts performance…
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