Tektronix, Inc. has announced what it claims to be the industry's first transmitter test solution for the SuperSpeedPlus 10 Gb/s specification. The company has also launched a new USB 3.0 oscilloscope-based layered decode capability and an enhanced automated solution for SuperSpeed USB transmitter testing that improves test throughput by up to 60%.
With the faster data rates for USB 3.0 come new test challenges, most notably major increases in channel loss and reduction in signal to noise ratio as well as more complex link training and timing requirements that must be verified. As design margins shrink, it’s more important than ever to have an accurate and standard specific measurement system available. All of these needs are fully met by the Tektronix SuperSpeedPlus USB test solution (option SSP).
With tighter time constraints and more design complexity engineers need flexible tools that work across multiple layers of a bus to find problems faster. Tektronix USB 3.0 decode software simplifies debug with protocol-specific triggering, easy to use search and navigation, and multi-layer decode. This allows the user to easily navigate through the protocol stack, fully time correlated with the analog waveform on the same screen.
The new TekExpress USB automation software (Opt USB-TX) incorporates a new software architecture that provides significantly improved performance. Customers will see improvements in test times of about 60 percent. For example, previously USB 3.0 Tx tests completed in 12 minutes, but now with the new TekExpress software testing completes in five minutes The new TekExpress USB 3.0 transmitter test software (Option USB-TX) and SuperSpeedPlus USB transmitter test software (Option SSP) will both be available for download on www.tek.com in July 2013.
The new SuperSpeedPlus transmitter test software (Option SSP) will be available for download on www.tek.com in late July 2013.
The USB 3.0 decode will be a free upgrade for customers with a DPO/DSA/MSO70000 Series Oscilloscope with option SR-USB which will be available in July 2013.