TI targets "Jacinto 6" OMAP SoC at in-vehicle apps - Embedded.com

TI targets “Jacinto 6” OMAP SoC at in-vehicle apps

Texas Instruments Inc .  has introduced an OMAP-based system-on-chip targeted at the compute-intensive needs of many next-generation in-vehicle entertainment and telematics applications in automobiles.

Codenamed “Jacinto 6,” the new DRA74x processor builds upon TI's proven OMAP 5 architecture to enable optimized automotive solutions, adding audio, analytics and radio accelerators, along with automobile interfaces and peripherals.

According to Curt Moore, general manager of automotive for TI's OMAP product line, integrating automotive interfaces with the processor architecture can decrease an automotive infotainment customer's electronic bill of materials (BOM) by up to 25% or more, while delivering best-in-class performance capabilities.

“Today's consumers expect always-on connectedness, with information and entertainment at their fingertips in every environment – at work, at home, at play and on the road,” he said.

More added that with the OMAP 5 architecture at its foundation – including dual ARM Cortex-A15 cores, dual Cortex-M4 cores and multi-Imagination Technologies' POWERVR SGX544-MPx graphics cores – the latest DRA74x processor increases ARM CPU performance up to five times and graphics (GPU) performance close to seven times as compared to the previous “Jacinto 5” offering.

To accommodate automotive applications in includes such capabilities as AEC Q100 qualification and wide-temperature support; automotive interfaces such as 2x CAN, MOST Media Local Bus (MLB), PCIe, Ethernet AVB, and 3.3V I/Os.

Also available is an optional 680 MHz floating-point VLIW DSP for integration of software defined radio, advanced audio and speech processing.

The SoC also incorporates multiple high-definition camera and video input ports to enable next-generation surround-view camera and consumer devices and incorporates TI's WiLink 8Q wireless automotive connectivity offering.

The DRA74x “Jacinto 6” processor will sample in mid-2013 and is expected to be available for production by the second half of 2014.

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