TI’s ESC DESIGN West Launchpad challenge - Embedded.com

TI’s ESC DESIGN West Launchpad challenge

TI has just announced its’ MCU BoosterPack Design Challenge, the winner of which will get a free trip to ESC DESIGN West 2013.

Engineers, university students and hobbyists in the United States using the MCU LaunchPads can submit their original BoosterPack plug-in module designs for the chance to win a trip to ESC DESIGN West 2013 to demonstrate their designs.

This contest will run from Jan. 15 to March 1 with three winners announced on March 22, 2013.

Entrants may also have the opportunity to have CircuitCo consider their designs for manufacture.

TI MCU BoosterPacks are plug-in modules that enable developers, students and hobbyists to add greater functionality and peripherals to one of three TI MCU LaunchPad evaluation platforms.

Up to three winners will be flown to San Jose, Calf. to demonstrate their winning designs in the TI booth (#1607) at the ESC DESIGN West 2013.

For the avoidance of doubt, TI will not be under any obligation to manufacture any BoosterPack plug-in module designs. For more information on BoosterPack plug-in modules and to see previous examples, designers can go to www.ti.com/bpdc-pr-lp7.

Makers can design a BoosterPack leveraging the differentiated features of any of the three TI MCU LaunchPad evaluation kits: MSP430 LaunchPad, C2000 LaunchPad and Stellaris LM4F120 LaunchPad. The TI MCU LaunchPad ecosystem allows engineers to design easy-to-use, modular boards targeted at low-power, real-time control and connectivity applications.

BoosterPack plug-in modules enable greater functionality, flexibility, peripherals and scalability to easily extend LaunchPad's capabilities with LCD, LED lighting, capacitive touch, motor control, Bluetooth® and more.

TI MCU BoosterPack Design Challenge guidelinesChallenge participants will have until March 1, 2013 at 11:59 p.m. CST, to submit an original BoosterPack design online at www.ti.com/bpdc-pr-ep.

Several of the requirements include:

1) Providing a schematic and a brief, written description of the BoosterPack design;

2) Designing a BoosterPack with bill of materials (BOM) not exceeding $40 USD;

3) Conforming to the BoosterPack pinout standard.

4) Uploading the project to either Google Drive or Github online file sharing systems.

5) Recording a video describing the BoosterPack idea and uploading it to YouTube.

To read the full contest rules applicable to this contest, go to www.ti.com/byob-bpdc-pr-rules.

After the challenge deadline, a judging panel consisting of individuals from TI, Mouser and CircuitCo will determine the three contest winners. The online community can show their support via Facebook Likes and the Make the Switch forum.

Winners will be announced March 22, 2013 on the TI contest page.  For more information about this contest and to submit an original BoosterPack design, visit www. ti.com/byob .

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