TI's TDA3x processor powers advanced driver assistance apps - Embedded.com

TI’s TDA3x processor powers advanced driver assistance apps


Texas Instruments is introducing the newest member of the company's automotive system-on-chip (SoC) family, the TDA3x solution. The TDA3x processor family is designed to help car manufacturers develop sophisticated advanced driver assistance systems (ADAS) applications that meet or exceed NCAP requirements, reduce collisions on the road and enable a more autonomous driving experience in entry- to mid-level automobiles. Developed on the same architecture as other TDA devices, the TDA3x offering extends scalability from the TDA2x devices on front camera, surround view and fusion applications with the addition of smart rear camera and radar.

The TDA3x family supports ADAS algorithms such as lane keep assist, adaptive cruise control, traffic sign recognition, pedestrian and object detection, forward collision warning and back over prevention. These algorithms are critical to the effective use of a broad range of ADAS applications, including front camera, surround view, fusion, radar and smart rear camera. The TDA3x processors will allow customers to develop ADAS applications that address cost-sensitive NCAP programs such as Autonomous Emergency Braking (AEB) for pedestrians and cyclists, Forward Collision Warning (FCW) and Lane Keep Assist (LKA).

The TDA3x SoC is based on a heterogeneous, scalable architecture that includes TI's fixed-and floating-point dual TMS320C66x generation of DSP cores, fully programmable Vision AccelerationPac containing an Embedded Vision Engine (EVE), dual ARM Cortex-M4 cores along with an image signal processor (ISP) and a host of peripherals.

The TDA3x SoC introduces the automotive industry to the first package on package (PoP) including DDR with DDR memory , enabling miniaturization of ADAS cameras or radar systems. Having the capability to mount memory and flash on top of the TDA3x package reduces both the footprint and the board complexity, thus adding processing capability without increasing the size of the module. Multiple memory vendors including Micron, ISSI and Winbond will be providing custom PoP memory for the TDA3x SoC.

By integrating an ISP that enables raw/Bayer sensors, the TDA3x processor delivers improved image quality without increasing the size, cost or complexity of the solution. Variants of the TDA3x SoC have full featured ISP including noise filters, color filter array, video noise temporal filtering (VNTF), exposure and white balance controls, as well as optional support for wide dynamic range (WDR) and lens distortion correction (LDC). The ISP can support a range of combinations for mono, stereo and up to four camera inputs providing an industry leading integrated solution.

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