TI's WLAN developer kit targets handheld device connectivity - Embedded.com

TI’s WLAN developer kit targets handheld device connectivity

Texas Instruments' consumer electronics WLAN Developer Kit (CE WLAN DK) 2.0 delivers Wi-Fi connectivity battery-operated devices such as PDAs and digital still cameras.

The CE WLAN DK 2.0 offers OEMs complete development platforms for embedding Wi-Fi in their devices and enables broadband providers to add WLAN to their DSL, cable and voice products.

Products leveraging TI's recently announced CE WLAN DK 1.0 for stationary and 2.0 for portable applications enable consumers to enjoy the most robust Wi-Fi experience regardless of their location. TI technology allows users to easily configure their WLAN and exchange audio and video files or other data wirelessly between devices like PMPs, without the fear of dropped signals or loss of battery power.

Systems-level tools include host processor support, the CE WLAN DK 2.0, and access to TI's third party network.

TI's CE WLAN DK 2.0 is built to interface directly with leading processor platforms using an SDIO interface such as OMAP processors and processors based on DaVinci technology.

The kit delivers 50 percent greater throughput and twice the range of competing solutions. The SDIO interface has been maximized to deliver 20+ Mbps throughput to the host processor while consuming minimum host resources.

The kits also features receive sensitivities better than -75dBm at 54 Mbps OFDM. Portable applications can adjust the output power to maximize reach or minimize battery use with variable output power from 6 to 16 dBm.

TI's WLAN subsystem features a small form factor ideal for portable applications. Manufactured in 90nm advanced RF-CMOS process, the subsystem is 11mm x 11mm x 1.5mm and includes the media access controller (MAC) baseband (BB) processor /radio, power amplifier, battery power management, EEPROM, crystal and band pass filter and associated remaining bill of materials (RBOM). The RBOM is just 22 components, a third of competing solutions.

In addition to TI platforms, manufacturers can leverage the company's partner network to speed development time and further differentiate next-generation products. Portable partners include eSOL, Ittiam, Ingenient and JorJin who offer products from simple operating system (OS) ports to complete end-equipment reference designs.

The CE WLAN Development Kit for portable devices includes a hardware reference design, chipset and software driver package.

  • Hardware Reference Design (PCA-202): The complete reference design utilizing TI's WLAN chipset is designed to pass FCC and Wi-Fi certification, enabling manufacturers to reach the market quickly.
  • WLAN Chipset (TNETW1351/TNETW3526/5100): The TNETW1351 is the single-chip MAC baseband processor/radios in 90nm RF-CMOS process technology. The TNETW3526 is the power amplifier and the 5100 is the battery power management for the WLAN subsystem. The chipset is optimized for sensitivity, minimal battery power use and small size.
  • Software Driver Package (CE-STA-DK 2.0): TI's full featured software driver package enables security including Wi-Fi Protected Access (WPA) and WPA2, quality of service including Windows Multimedia (WMM) and 802.11e,and, ease of use including Wi-Fi Simple Configuration support. The SDIO interface offers the highest throughput, maximized to deliver 20+ Mbps, with the lowest CPU utilization.

More information is available at www.ti.com/cewlan.

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