UltraFlat process for vertical probe card applications - Embedded.com

UltraFlat process for vertical probe card applications

The UltraFlat process from Multitest is designed to meet the requirements of high parallel vertical probe card applications.

For applications such as DDR3 memory, the requirements for the flatness of boards at wafer level testing become crucial. For optimizing MLO/MLC attachments and contact element interfaces, a better surface is needed. Additionally, flatter PCBs require less compliance from the probe interface and reduce interface wear.

Leveraging the knowledge of PCB stack up engineering and PCB construction, Multitest developed the UltraFlat process to meet these requirements. It allows for a  tight overall flatness tolerance to be maintained by removing the bow/twist in the PCB. Unlike “flat-baking” that provides a temporarily flat PCB, Mutltitest’s UltraFlat process provides a permanent overall flatness for the PCB. This enables Multitest to typically be able to comply with bow/twist requirements of 1.0 percent.

Leave a Reply

This site uses Akismet to reduce spam. Learn how your comment data is processed.