LONDON QNX Software Systems has released version 6.4.0 of its Neutrino RTOS and Momentics Tool Suite, the first major product developed under the company's hybrid software model.
The QNX Neutrino RTOS release 6.4.0 includes a fail-safe file system to protect critical data in the event of a sudden power failure or shutdown; a faster networking stack that supports BSD 4.0 TCP/IP; variable page size tuning for faster OS performance; and certification to the POSIX PSE52 standard for greater source-code portability.
This release also has 802.11 a/b/g wireless networking support; improved ARMv6 memory management and vector floating point math support for ARM11 processors; symmetric multiprocessing (SMP) support for the Renesas 7786 processor; and e500 SMP support for the Freescale MPC8572 processor.
QNX Software Systems has entered the QNX Neutrino 6.4.0 microkernel for Common Criteria certification to the Evaluation Assurance Level 4+ (EAL4+).
The QNX Momentics Tools Suite enhancements include a high-resolution application profiler that detects sluggish areas of application code through both instrumentation and statistical sampling; support for the latest versions of the GNU toolchain (4.2.4) and Eclipse CDT (4.0.x); and JTAG debugging.
Release 6.4.0 is the first major QNX product to be developed 'live' on Foundry27, the development portal where customers and other QNX community members can access new software features and patches in real time, download OS source code, and participate in the development of QNX products.
Since its launch in September 2007, the QNX Foundry27 community has grown to more than 20,000 members, with multiple customer, partner, and employee projects underway, and several active forums with large numbers of posts each month.
By participating in Foundry27, customers and other community members can provide feedback on new software features as the features are being developed; they can also download new features and patches as soon as they become available — there’s no need to wait for a major product release.