A range of cold plates that meet the most recent VME64x/VPX standards and supports commercial off-the-shelf packaging formats have been developed by Thermacore Inc.
These high conductance cold plates are designed to improve electronics cooling performance compared to conventional technologies used in demanding military and aerospace applications.
The lightweight, ruggedized cold plates, available in 3U, 6U and 9U formats, provide superior thermal performance with good temperature uniformity, resulting in lower electronic component temperatures and increased operational life and reliability.
Thermacore offers the VME64x/VPX cold plates in three technology options. Selecting the appropriate cold plate technology is dependent on the application need for thermal performance, weight, and cost.
- Baseline Aluminum Cold Plate. Produced from highly thermally conductive aluminum alloys such as 6061 and 6063 with thermal conductivity values of 166 and 201 W/m-K to meet the VME64x/VPX standards, these cold plates meet the needs of the most basic performance requirements.
- k-Core Cold Plate. With up to six times the conductance of solid aluminum designs and up to 20 percent lower mass, Thermacore's k-Core material – a patented system that encapsulates Annealed Pyrolytic Graphite (APG) with the same aluminum alloys as basic solid aluminum cold plates – boosts the thermal performance of the basic solid aluminum cold plates to even lower temperatures while reducing system mass
- Embedded Heat Pipe Cold Plate. This cold plate option is constructed from solid aluminum that is integrated with heat pipes to remove 'hot spots' from the applications where heat loads are concentrated. Thermacore's embedded heat pipe cold plates provide thermal performance improvement when compared with typical solid aluminum or copper-based cold plates in electronics or computers, where the heat source is small.