Wavenis compliant SOC goes in to production - Embedded.com

Wavenis compliant SOC goes in to production

LONDON — Essensium N.V. has become the first semiconductor member of the Wavenis Open Standard Alliance (Wavenis-OSA) and is advancing its partnership with Coronis S.A.S. for a Wavenis compliant SOC.

Essensium N.V. (Leuven, Belgium,), a spin-out from IMEC, has been working with Coronis (Pérols, France) since 2007.

Wavenis is a wireless technology platform which was originally developed by Coronis to address the needs of advanced metering infrastructures, wireless sensor networking and other M2M applications.

In June 2008, Coronis gave the specification of Wavenis to the Wavenis-OSA (royalty-free), who now manages the technology roadmap and standardization activities. Wavenis is currently installed in more than 4 million devices in the field around the world with the largest network having 100,000 nodes.

The core of the Wavenis technology is its power optimized wireless communications protocol combined with an advanced sub-GHz RF transceiver.

The first production batch of silicon, a low power transceiver that meets the Wavenis specifications, has been fabricated.

“Thanks to the professional collaboration between our two teams, Essensium is helping us to successfully deliver the first Coronis Wavenis compliant SOC,” said Laurent Maleysson, managing director of Coronis. “This is a major step for us and will serve as the cornerstone for all our future offerings in target markets such as smart metering, home and building automation, alarm & security, industrial, environment, smart cities, medical, UHF track & trace and more.”

Essensium power optimized the Coronis wireless transceiver architecture and merged it with a low power 32-bit RISC microprocessor into a single SOC solution. The embedded RISC controller runs a RTOS and the Wavenis communication protocol stack, while 1Mb of embedded memory is available for program code and data.

The Coronis SOC is going to replace the 2-chip current platform and its multitude of discrete components, resulting in a higher performance, lower cost and smaller form factor module to better fit a wide variety of metering and non-metering applications in a very competitive wireless landscape.

Related links and articles:

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