What's New on Embedded.com (1-13-12 to 1-19-12) - Embedded.com

What’s New on Embedded.com (1-13-12 to 1-19-12)

Embedded Newsletter for 01-19-2012

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January 19, 2012

New on Embedded.com

Exclusives

Mark Grayson, Kevin Shatzkamer and Klaas Wierenga, Cisco Systems

Mobile Internet basics: Transport layer mobility challenges

Highlights

Design Patterns

CES: What I liked, hated and wondered about

Reporter's notebook: Why we go to CES


Editor's Note

Bernard Cole Bernard Cole
Site Editor
Embedded.com

Embedded and electronics companies continue to aggressively drive products and technologies onto the market, despite Taiwan Semiconductor's Morris Chang forecast that annual growth in semiconductors in 2012 will be only 2 percent .

For example, reflecting a continued trend toward more connectivity, Texas Instruments just introduced its SimpleLink to connect objects with Wi-Fi, ST introduced its GreenNet home network of sensor nodes, Laird introduced an M2M wireless gateway , Powercast introduced its long life wireless sensors , MIPI offered a new RF control spec , and the openPICUS platform for smart sensor networks was introduced. Processor activity also continues hot and heavy, with Intel providing more details about its low power Medfield processor (ARM's Warren East isn't impressed ), Freescale debuting i.MX.6 processors for industrial control, and ST offering an audio processor for MEMS microphones.

But if you want to see some real street action, tune into UBM's continuing Chevy Volt coverage at Drive for Innovation and follow the cross-country journey of EE Life editorial director, Brian Fuller. On his trip, sponsored by Avnet Express, Fuller is driving a Volt across America to interview engineers about innovation.

Then there's Jack Ganssle on “Design Patterns,” Junko Yoshida on “Why we go to CES?” and Rick Merritt on”What I liked, hated and wondered about CES, ” as well as a six part series on Mobile Internet device and system design.


Design How Tos

Mobile Internet basics: Transport layer mobility challenges

In this series, the authors of “Building the Mobile Internet” provide a tutorial on extending Internet connectivity into mobile networking by using extensions of protocols such as IPv4 and IPv6 as well as mobile specific protocols such as DSMIP, IKEv2 and MoBIKE. Part 1: Dealing with transport layer mobility.

Mobile Internet basics: Mobile IPv4 Registration and AAA

In this series, the authors of “Building the Mobile Internet” provide a tutorial on extending Internet connectivity into mobile networking by using extensions of protocols such as IPv4 and IPv6 as well as mobile specific protocols such as DSMIP, IKEv2 and MoBIKE. Part 2: Mobile IPv4 Registration and AAA

Mobile Internet basics: Mobile IPv4 Tunnels, Bindings & Datagrams

In this series of six articles, the authors of “Building the Mobile Internet” provide a tutorial on extending Internet connectivity into mobile networking by using extensions of protocols such as IPv4 and IPv6 as well as mobile specific protocols such as DSMIP, IKEv2 and MoBIKE. Part 3: Mobile IPv4 Tunnels, Bindings, & Datagram Forwarding.

Mobile Internet basics: Mobile IPv6 technology overview

In this series, the authors of “Building the Mobile Internet” provide a tutorial on extending Internet connectivity into mobile networking by using extensions of protocols such as IPv4 and IPv6 as well as mobile specific protocols such as DSMIP, IKEv2 and MoBIKE. Part 4: Mobile IPv6 technology overview

Mobile Internet basics: Mobile IPv6 in Practice

In this series, the authors of “Building the Mobile Internet” provide a tutorial on extending Internet connectivity into mobile networking by using extensions of protocols such as IPv4 and IPv6 as well as mobile specific protocols such as DSMIP, IKEv2 and MoBIKE. Part 5: Mobile IPv6 in Practice

Mobile Internet basics: IkeV3 and MOBIKE

In this series, the authors of “Building the Mobile Internet” provide a tutorial on extending Internet connectivity into mobile networking by using extensions of protocols such as IPv4 and IPv6 as well as mobile specific protocols such as DSMIP, IKEv2 and MoBIKE. Part 6: IkeV3 and MOBIKE

Bluetooth low energy and proprietary RF for HID applications—A comparison

This article reviews and compares the Bluetooth Low Energy technology with proprietary protocols in the HID market. A look at interoperability, flexibility, complexity, power, and cost.

When the Power Fails: Designing for a Smart Meter's Last Gasp

A smart meter is powered by the same bus the meter is monitoring. When power is lost, the meter must record state information to flash memory or send out a wireless signal — the meter's last gasp. The problem of efficiently and cost-effectively providing hold-up energy typically falls to power supply designers. Try one of these flyback switch mode designs to provide for that last gasp.

Power-management functions for energy harvesting

Understand the functional blocks needed for this role in a harvesting design

Comparing FMCs with PMCs/XMCs for harsh environments (Part 1)

For embedded military and aerospace applications, FPGA mezzanine cards (FMCs) provide a simple, high I/O solution while offering enhanced design freedom.


Embedded Systems Bookshelf

Excerpts

Embedded Books Reading Room
Bernard Cole's favorite links to book excerpts.

Reviews

Engineer's Bookshelf
Airport fiction blows. A look at books other engineers are reading and why you should read them, too. Recommend and write a review yourself. E-mail Brian Fuller.

Jack Ganssle's Bookshelf
A list of book reviews by Jack Ganssle, contributing technical editor of Embedded Systems Design and Embedded.com.

Max's Cool Beans
Clive “Max” Maxfield, the editor on Programmable Logic DesignLine, often writes about interesting books.


Product News

Low-power, long-life wireless sensors eliminate the need for battery replacement

Powercast Corporation has expanded the capabilities of its Lifetime Power Wireless Sensor System with two ultra-long-life, battery-powered sensors.

Open source platform for smart sensors

The openPICUS open source platform for embedded applications is a standalone internet-enabled module designed for smart sensor networks and M2M communications.

M2M wireless gateway bridges different wireless networks

Laird Technologies' APG BT W400 wireless access point gateway has been designed for M2M wireless communications and for connecting Bluetooth enabled devices in a Personal Area Network to IP network via Ethernet or WLAN interface.

Set-top box reference board offers cloud compatibility

Renesas Electronics has developed of an ultra-compact reference board that can be used as an IP network–compatible High Definition set-top box (STB) solution.

Strategic's low-cost i.MX283 COM targets fanless applications

Strategic Test has announced the tTX-28S, a new low-cost addition to its line of Freescale-based i.MX Computer-on-Modules (COMs).

New version of PLS Universal Debug Engine simplifies multicore control and debugging

PLS Universal Debug Engine (UDE) 3.2 features new functions for multicore control, unique visualization capabilities at system level, and dedicated support for a wide range of the latest 32-bit SoCs from different manufacturers.

MMIC band pass filter tunes from 19 to 38 GHz

Hittite Microwave Corporation has introduced a tunable MMIC band pass filter for hybrid and microwave integrated circuit (MIC) applications in wideband test and measurement equipment, communication systems and electronic warfare (EW) subsystems to 38 GHz.

ST offers audio processor for multiple MEMS microphones

STMicroelectronics NV has introduced a digital audio processor IC that is intended for use in multi-microphone applications.


News

Seven standards bodies form global M2M initiative

Seven standards developments organizations have agreed to work together on common global standards for machine-to-machine (M2M) communications.

ST creates home network of self-powered nodes

STMicroelectronics NV has developed a platform for smart buildings called GreenNet that includes self-powered wireless sensor nodes that can be used to monitor a variety of parameters including temperature and movement.

TI’s SimpleLink connects everyday objects with Wi-Fi

The Internet of Things has long been a buzz phrase in the technology industry, with a bevy of experts predicting that someday soon, billions of mundane household appliances could be connected to the cloud, yet so far, that notion has remained right around the corner.

MIPI Alliance offers new specs for RF control

Today, the MIPI Alliance announced new DigRF and RFFE specifications, and yesterday, I had the opportunity to speak with Jim Ross, of Skyworks, and Dr. Dietmar Wenzel, of Infineon about the changes. Both men are part of the MIPI Alliance.

Intel tips Medfield specs, Lenovo, Motorola deals

Intel Corp. has provided details of its Medfield 32-nm platform for smartphones claiming that the main SoC consumes less than 800-mW worst case. It has also announced that it has deals in place with Lenovo and Motorola for products based on Medfield to appear in 2012.

ARM’s East unimpressed with Medfield, design wins

Warren East, CEO of processor technology licensor ARM, is unimpressed by the announcements made by chip giant Intel about the low-power Medfield system-chip and its design wins, according to a Reuters report.

Windows on ARM will not be terribly successful says a

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