What's New on Embedded.com (11-23-11) - Embedded.com

What’s New on Embedded.com (11-23-11)

Embedded Newsletter for 11/23/11

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November 23, 2011

New on Embedded.com

Exclusives

Mohit Arora, Freescale Semiconductor

Securing your apps with Public Key Cryptography & Digital Signature

Michael Baker

Choosing sensors: Specsmanship vs. reality

Deepak Behera, Sumit Varshney, Sunaina Srivastava, and Swapnil Tiwari, Freescale Semiconductor

A brief primer on embedded SoC packaging options

Highlights

Packaging: Embedded design challenges ahead

The dumbing down of embedded design

Monolithic stupidity


Editor's Note

Bernard Cole Bernard Cole
Site Editor
Embedded.com

We have lots of food for thought on Embedded.com this food-focused holiday weekend. In “The dumbing down of embedded design,” Jack Ganssle takes another skeptical look at Android and Linux, and takes to task those who think the MCU and the RTOS are dead.

In “Monolithic stupidity , ” David Kleidermacher points to the vulnerability of monolithic RTOSes to computer viruses like Duqu as another reason to believe that alternative microkernel-based RTOSes are the wave of the future.

Michael Bear, in “Choosing sensors , ” provides some guidelines and tools for sorting through the parameters that describe the performance and reliability of sensors, and tells how to separate the specsmanship from the reality.

To keep up with our ongoing Chevy Volt coverage, go to Drive for Innovation and follow the cross-country journey of EE Life editorial director Brian Fuller. On his trip, sponsored by Avnet Express, Fuller is driving a Volt across America to interview engineers about innovation.


Design How Tos

Securing your apps with Public Key Cryptography & Digital Signature

This article provides some basic information about the security mechanisms behind Public Key Cryptography with practical details on how it is used by some of the popular tools like PGP, SSL as well as Digital Signature.

A brief primer on embedded SoC packaging options

This article addresses the basics of packaging such as types of packages and their advantages and disadvantages, future trends, and factors to be considered while choosing a package.

Choosing sensors: Specsmanship vs. reality

Compared with individual parameter specification, the total error band envelope yields results that are more representative of how a sensor will respond in actual use.

Use Smart Services to take advantage of M2M connectivity

In this Product How-To article, Kevin Rhoads of Kontron explains benefits of using the company's M2M Smart Services Developer Kit to accelerate the creation of wireless smart services applications and provide a pre-validated platform for M2M software.

Selecting 8-bit MCUs: A practical guide

Many devices may be available that will do the job, but tailoring the selection tightly to your particular needs can make for a much smoother ride in the long run.

Evolving energy harvesting with FRAM

Low-power MCUs with FRAM eliminate power consumption and write-endurance barriers to energy harvesting, letting developers make the world “smarter” with more cost-efficient, simpler designs.

System Performance Analysis and Software Optimization Using a TLM Virtual Platform

A global leader in aerospace electronics needed to quantify the performance of their customers' embedded code running on one of their delivered systems…

Understanding the security framework behind RSA SecurID

This article takes you through the two-factor authentication-base RSA SecurID security protocol – not to be confused with the RSA public key cryptographic mechanism – and how to use it for providing secure remote access for a user to a network resource as well as some potential vulnerabilities to guard against.

A new wave in wireless: Small cells for a heterogeneous network

The latest releases of the LTE specs include HetNet, which relies on SoC integration. Here's a look at HetNet challenges and solutions.

Backhaul for small cells: A 1.5 billion dollar market opportunity

In the strategic plans of leading major network operators, handling dense data traffic loads has become more critical than voice coverage in every corner.


Embedded Systems Bookshelf

Excerpts

Embedded Books Reading Room
Bernard Cole's favorite links to book excerpts.

Reviews

Engineer's Bookshelf
Airport fiction blows. A look at books other engineers are reading and why you should read them, too. Recommend and write a review yourself. E-mail Brian Fuller.

Jack Ganssle's Bookshelf
A list of book reviews by Jack Ganssle, contributing technical editor of Embedded Systems Design and Embedded.com.

Max's Cool Beans
Clive “Max” Maxfield, the editor on Programmable Logic DesignLine, often writes about interesting books.


Product News

IAR offers starter kit for ST's high-performance STM32F407ZG MCU

IAR Systems has launched a new 32-bit KickStart Kit for STMicroelectronics' STM32F407ZG, a microcontroller (MCU) in ST's STN32 F4 series, the first ARM Cortex-M4 based MCUs.

CEVA-TeakLite-III DSP IP core approved for Dolby MS11 Multistream Decoder

CEVA's Dolby MS11 and Dolby Volume solutions provide significant cost and time-to-market advantages for customers' next-generation home entertainment SoC designs…

Silicon MEMS clocks for Stratum 3 attack quartz-based timing approaches

SiTime SiT5301 and SiT5302 offer better performance, smaller size than OXCO, TXCO crystal-based devices

Silicon temp sensor guarantees high accuracy, resolution across a wide temperature range

Microchip's latest sensor provides ± 0.5 degrees accuracy and 12-bit resolution from -20 to +100 degrees Celsius.

ST's 32-bit TPM supports next-gen TCH standards

STMicroelectronics has rolled the ST33TPM12LPC Trusted Platform Module (TPM), which the company claims is the industry's highest performing TPM, enabling significantly stronger security and trust for activities such as e-commerce and cloud-computing services.

Digital color sensors feature on-chip IR filtering and proximity sensing

TAOS released what it claims is the industry's first color sensors with an on-chip infrared (IR) blocking filter and proximity sensor.

Hittite releases programmable direct conversion receiver

Fully field programmable, the HMC6383 platform is designed to serve as a receiver subsystem building block for various applications including cellular basestations, microwave radio, adaptive IF strips, wireless LAN, software defined radio and test equipment.

FlexRay transceiver designed for high temp auto applications

austriamicrosystems' latest FlexRay transceiver will be shipped in bare dice and an SSOP20 package for critical powertrain applications.

Xilinx connectivity IP cores for next-gen LTE/LTE-A wireless infrastructure

Three new Xilinx connectivity IP cores are vital for building programmable, flexible, and cost-effective 3G+/4G wireless base stations…

Microsemi offers 4GB DDR3 SDRAM for high-reliability apps

COTS device supports high-performance processors and chipsets.


News

Microsoft preps Kinect for Windows hardware

Microsoft confirmed it is developing hardware to bring its Kinect interface to Windows and launching a competition to give $20,000 to startups with ideas for using it.

TechInsights says Kindle Fire BoM about $143

The bill of materials cost of Amazon's Kindle Fire media tablet is roughly $143, significantly lower than some analysts estimated previously, according to a preliminary teradown analysis conducted by market research firm UBM TechInsights.

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