Being inaugurated today on line isUBM Electronics Virtual Event: ESC Silicon Valley , the first of several online virtual events to be held over the next few months. It will be available later for viewing also. There you can download materials from classes and view online videos of speakers and attend webinars. And if you want to ‘walk” the show floor, we’ve created an ESC Silicon Valley Video Channel on YouTube , with videos of interviews with vendors.
In addition, this week Jack Ganssle reviews some of the most impressive technology showcased at the recent ESC in “My Spring ESC highlights.” And in my Cole /bin column “Digging for gold at ESC ” I comment on trends and developments evidenced at the ESC in San Jose and in Chicago. Also, in “Wozniak, crashing spacecraft and emerging Android on-demand ” Ron Wilson provides his perspective on events he found worthy of note at the Spring ESC.
Bring app downloadability to small footprint RTOSes using a new architectural feature called “downloadable application modules,” which cheat the linker to isolate parts of a program from each other via the kernel, allowing downloads during execution of the program.
Integration of analog with digital and increase in on chip features in mixed-signal controllers demand more complex I/O structures as well, but are often the most neglected features of a chip. This two part article will provide the basics for allowing developers to optimize their performance and functionality. Part 1: The I/O building blocks.
Having dealt in Part 1 with some of the basics of SoC I/O pin assignment, in this second part we will deal with a variety of implementation issues, including hot swap, interrupts, pin assignments and Interfacing with the devices being operated at voltage other than SoC's core voltage
There is increased activity around the 'internet of things'; the ability to create networks of small devices that monitor and control our surroundings to create a sort of 'augmented reality'.
This article presents a new approach, titled Adaptive Real Time Monitoring (ARTM), and compares it against other possible methods: FFT algorithms and bandpass filtering. ARTM will be featured in the next generation Analog Devices (ADI) products for energy applications.
Part 3 of an excerpt from the book “6LoWPAN: The Wireless Embedded Internet” reviews the 6LoWPAN architecture, and then examines its protocol stack and three link-layer technologies used with 6LoWPAN.
ASTRAL, which stands for Autonomous System and Transmission wireless sensor network for space applications, is designed to develop a demonstrator to validate the concept of adapting wireless technology for space missions. The result was a demonstrator for monitoring vibration in satellites on the ground and during the launch over approximately 30 minutes.
Here is the first segment of Chapter 6 of the Sensors Handbook, 2nd Edition, titled Industrial Sensors and Control. This segment is a discussion of temperature sensors in process control.
This article explores the impact of USB 3.0 on mobile handheld hardware and software design and what can be done, through proper I/O management, to improve interactions between USB 3.0 connected components.
Engineer's Bookshelf Airport fiction blows. A look at books other engineers are reading and why you should read them, too. Recommend and write a review yourself. E-mail Brian Fuller.
Jack Ganssle's Bookshelf A list of book reviews by Jack Ganssle, contributing technical editor of Embedded Systems Design and Embedded.com.
Max's Cool Beans Clive “Max” Maxfield, the editor on Programmable Logic DesignLine, often writes about interesting books.
The new Ultra COMM+8.PCIE serial interface from Sealevel Systems, Inc. is designed to deliver ultimate flexibility for expanding serial communications in a variety of test and measurement, process control, and point-of-sale applications. Compatible with any PCI Express slot, the board provides eight multifunction serial ports, each individually field-configurable for RS-232, RS-422, or RS-485.
Atmel Corporation has integrated its new Sensors Xplained software drivers with the recently-launched AVR Studio 5 Integrated Development Environment (IDE).
Kontron today introduced its new machine-to-machine (M2M) Smart Services Developer Kit with a deployable Intel Atom processor-based services-ready system.
The CS1501 and CS1601 from Cirrus Logic are digitally controlled, variable frequency discontinuous conduction mode (VF-DCM), active power factor correction (PFC) ICs intended for use in switch-mode power supplies rated up to 300 watts.
Fairchild Semiconductor's FDMS36xxS family of power stage dual asymmetric MOSFET modules incorporates a control and synchronous MOSFET, as well as a monolithic Schottky body diode in a PQFN package.
Maxim Integrated Products has introduced the MAX17710, which it claims is the industry's first IC to integrate all of the power-management functions for ambient energy harvesting, as well as for charging and protecting micro-energy cells (MECs), a form of solid-state battery.
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