If you think the best strategy is to keep your head down and plow ahead with your next product design there are a number of technical articles in this issue which may help. In addition to my Editor’s Top Picks – “Managing ARM system cache coherency” and “Minimize leakage in embedded SoC designs ” – article topics include generating C code automatically, PID controller design and prototyping, and troubleshooting RFI EMC problems .
In this Product How-Two article, the Cadence authors describe how to use the company's Verification IP solutions framework to implement ARM's AMBA 4 Coherency Extensions (ACE) in embedded SoCs
The authors describe the use of a multithreshold voltage (Multi-Vt) flow technique that does not require embedded SoC architecture changes and allows a designer to decide when to use Low-Vt cells, which have better timing but higher leakage power, and when to use High-Vt cells which have lower leakage but worse timing.
Nick Lethaby and Denys Dmytriyenko of Texas Instruments provide an overview of the key elements of the Open Embedded Linux (OE) build environment and show how to use them to build and customize Linux distributions.
Over the next six weeks, we'll introduce you to considerations to aid with embedded processor design. This series is derived from the expertise of embedded processor software experts from Texas Instruments (TI) and is meant to provide an objective view of easing software design.
LEDs, both low-power indicators as well as high-power Lights, can enable an advanced User Interface as well as a high-end look-and-feel for today's smart appliances.
SoC devices will play an essential role in the universal 3D glasses market as they provide the ability to migrate from the traditional fixed function device to fully configurable devices.
DDD3 memory interface speeds have been going up steadily and are now approaching 2000 Mbps data rates. DDR4 is also nearly round the corner [6]. At these high data rates, it is becoming increasingly difficult to get good probing solutions which allow performing Signal Integrity characterization. High speed characterization is considered important for silicon based product development cycle. It is needed to understand the limitations of the current generation of DDR interface designs and to gear up our designs for next generations of DDR.
Part 3 of an excerpt from the book “Securing the Cloud: Cloud Computer Security Techniques and Tactics” briefly reviews data protection methods and any unique aspects that may apply when they are deployed in a cloud.
Engineer's Bookshelf Airport fiction blows. A look at books other engineers are reading and why you should read them, too. Recommend and write a review yourself. E-mail Brian Fuller.
Jack Ganssle's Bookshelf A list of book reviews by Jack Ganssle, contributing technical editor of Embedded Systems Design and Embedded.com.
Max's Cool Beans Clive “Max” Maxfield, the editor on Programmable Logic DesignLine, often writes about interesting books.
Microchip Technology Inc.'s new AC164144 PIC32 board is a low-cost, controllerless, graphics PICtail Plus daughter board that enables the development of graphics applications without an external graphics controller.
International Rectifier designed its latest high-side intelligent power switches with accurate current-sensing and built-in protection circuits for automotive applications.
Texas Instruments Incorporated (TI) touts their new TRF7970A contactless near field communication transceiver (NFC) as being the lowest power NFC in the industry.
The LEC-5510 in-vehicle computer from Lanner Electronics is designed to be used in all mobile land vehicles, including: construction equipment, semis, cabs, vans, trains and buses.
National Instruments has expanded its NI reconfigurable I/O (RIO) platform with the addition of the first multicore NI CompactRIO systems and smallest NI single-board RIO devices
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