While the immediate impacts of Japan’s triple whammy of earthquakes, tsunamis and nuclear plant problems are starting to settle, the secondary and tertiary effects of Japan’s disasters are making themselves felt throughout the world.
At first these events made me question the assumptions we make about the stability of the high tech society in which we are living. But on the positive side, these catastrophes made clear how our technology has interlinked individuals and corporations in a way that forces us to cooperate and resolve our differences. What affects one country or group of people affects us all: financially, professionally and personally.
As the embedded systems design community worldwide adjusts to the rippling economic and business effects of the devastation, many of you are adjusting the same way you did when the current worldwide economic downturn hit: by keeping your focus on the future – the next new technology, standard, product, and agreement to enhance this connectivity. Some of the design articles, columns, products and news features that illuminate this future focus are: Web TV specs, solid-state lighting , optimized cellular M2M, multi-core software challenges and learning from our software bugs.
For stability’s sake, keep your focus on the future and the balance that brings to your life, but don’t forget to also think about how you can contribute – personally and professionally – to helping the Japanese deal with the devastation and regain their balance and stability. We are not only close neighbors in this ever-shrinking world, we are partners in the global high tech business.
The processing demand from LTE is enormous and so the very latest DSP and general-purpose processor architectures must be designed to take advantage of the semiconductor capability.
X parameters open the door for a large set of possibilities in the arenas of design, modeling and simulation. In addition to providing better techniques for predicting signal integrity performance in high-speed networks, they will generate many opportunities for research, development while providing a deeper insight into nonlinear modeling.
Part 1 of an excerpt from the book “Designing with the mind in mind: A simple guide to understanding user interface design rules” explains and demonstrates factors that affect how quickly people can learn to use interactive systems.
A new device is invented based on a dual metal floating gate structure that can be employed as a unified memory, permitting combined dynamic and nonvolatile storage in the same device.
A typical SoC design for a consumer electronic device will have blocks that can be broadly classified into processors, DSP cores, peripherals, memory controllers, layered bus architectures and analog components. An optimal SoC verification strategy should address all the challenges that would be encountered during the process of verification. It should include answers to these questions: ''what to verify', 'how to verify' and 'are we done'.
That great big storage bucket in the sky – the vast array of networked devices we call 'The Cloud' is a growing presence in our lives. Now EDA had to find its place in the Cloud.
The HX336 from Xelerated is a wirespeed single-chip network processor (NPU) with advanced traffic management and deep packet buffering for 100GE/OTU4 systems, the latest addition to Xelerated's HX family of network processors. The HX336 reduces power consumption by approximately 50 percent compared to competing multi-chip packet processing and traffic management solutions.
Cellgo from eDevice is an external modem enabling serial devices to connect to the GSM/GPRS network through a single cable grouping both data and power signals. The internal Super Capacitor enables power-constrained products, such as battery-powered ones, to handle power bursts required during cellular data transmission.
ITTIA DB SQL, a relational embedded database for special-purpose systems that require self-contained data management software, is now available for ThreadX, an advanced lightweight real-time operating system (RTOS) from Express Logic, Inc.
Aeroflex Gaisler AB (Gothenburg, Sweden) has developed the GR712RC the fault tolerant processor, an implementation of a dual-core LEON3FT SPARC V8 processor using RadSafe technology.
Microchip Technology Inc. has expanded its 28-/40-pin PIC16F72X microcontroller (MCU) family with two additional 20-pin devices—the PIC16F(LF)720 and PIC16F(LF)721.
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