WLAN front-end solutions target mobile, MIMO markets - Embedded.com

WLAN front-end solutions target mobile, MIMO markets


Anadigics recently unveiled two new front-end products for wireless LAN (WLAN) mobile and multiple input multiple output (MIMO) applications. The front-end ICs (FEICs) employ the company's InGaP-Plus technology to increase integration and performance. The low-profile parts combine the power amplifier, low-noise amplifier, and RF antenna switch on a single die to minimize three-dimensional space requirements.

The AWL6254, for 802.11b/g applications, and AWL6255, for 802.11a applications, are aimed at such products as PDAs, mobile phones, smart phones, notebook computers, and USB adapters.

Combining the two parts results in a multi-band front-end solution for MIMO applications, which enable higher data throughput and greater WLAN coverage. These performance advantages support simultaneous multimedia wireless applications, such as high-definition (HD) video and voice-over-Internet protocol (VoIP) streaming audio.

The two ICs are designed for applications that require European Union's Restriction of Hazardous Substances (RoHS) products. The AWL6254 achieves an error vector magnitude (EVM) of less than 4% and current consumption of 90 mA at +17 dBm output power from the RF antenna switch. The AWL6255 achieves an EVM of less than 4% and current consumption of 90 mA at +15 dBm. The FEICs offer low noise amplification in the receive path and 1 kV protection against electrostatic discharge (ESD).

The AWL6254 and AWL6255 are priced at $1.29 and $1.54, respectively, in quantities of 10,000 units. For additional information, visit the company's Web site at www.anadigics.com.

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