Würth Elektronik eiSos to present new components for smart systems - Embedded.com

Würth Elektronik eiSos to present new components for smart systems


Würth Elektronik eiSos presents a wide variety of new electronic and electromechanical components at embedded world and provides the first insights and outlooks on its new product family sensors: temperature sensors, absolute and differential pressure sensors as well as three-axis acceleration sensors. Moreover, the proprietary module Thebe II, the WiFi module Calypso and the Bluetooth modul Proteus II represent the next represent the next step towards digital communication.

The wide bandwidth and high performance of the MagI³C power modules from Würth Elektronik eiSos are represented by MagI³C-VDRM (Variable Step Down Regulator Module). The compact step-down converter scores with integrated inductor and capacitors. Capacitors themselves are represented with no fewer than four different product series of H-Chip aluminum-polymer capacitors.

Miniaturization is an important topic for Würth Elektronik eiSos: With WE-CBF HF, the SMT ferrite for high frequency applications, tiny components make a huge impact on suppression. Further product highlights from the EMC specialists’ portfolio: WE-MAPI, one of the world’s smallest metal alloy power inductors, and WE-MCRI, an innovative, molded double choke. USB-3.1 type-C connectors with SuperSpeed technology are presented from the field of electromechanical components.

The Wireless Power Congress has been integrated into embedded world and Würth Elektronik eiSos is also very strongly represented in the new form of the congress. Experts from Würth Elektronik eiSos provide information with the following specialist presentations: Market and Future of the Global Wireless Power Transfer Industry; 15W Inductive Wireless Power Transfer with Integrated Data Communication; Wireless Power Transfer in Rotating Assemblies.

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