Xilinx FPGAs boast 16 nm with memory, 3D, and MPSoC enhancements - Embedded.com

Xilinx FPGAs boast 16 nm with memory, 3D, and MPSoC enhancements

Xilinx, Inc. has announced its 16nm UltraScale+ family of FPGAs, 3D ICs, and MPSoCs, combining new memory, 3D-on-3D and multi- processing SoC (MPSoC) technologies. To enable an even higher level of performance and integration, the UltraScale+ family also includes a new interconnect optimization technology, SmartConnect. These devices extend Xilinx’s UltraScale portfolio – now spanning 20nm and 16nm FPGA, SoC, and 3D IC devices – and leverage a significant boost in performance/watt from TSMC’s 16FF+ FinFET 3D transistors.

The newly extended Xilinx UltraScale+ FPGA portfolio is comprised of Xilinx’s Kintex UltraScale+ FPGA and Virtex UltraScale+ FPGA and 3D IC families, while the Zynq UltraScale+ family includes the industry’s first all-programmable MPSoCs. With this portfolio, Xilinx addresses a broad range of next generation applications, including LTE Advanced and early 5G wireless, terabit wired communications, automotive ADAS, and industrial Internet-of-Things (IoT) applications.

UltraRAM attacks one of the largest bottlenecks affecting FPGA- and SoC-based system performance and power by enabling SRAM integration. The new technology can be leveraged to create high capacity on-chip memory for a variety of use cases – including deep packet and video buffering – providing predictable latency and performance. By integrating massive amounts of embedded memory very close to the associated processing engines, designers can achieve greater system performance/watt and BOM cost reduction. UltraRAM scales up to 432 Mbits in a variety of configurations.

The processing sub-system also includes a dual-core ARM Cortex-R5 real-time processor for deterministic operation, ensuring responsiveness, high throughput, and low latency for the highest levels of safety and reliability. A separate security unit enables military-class security solutions such as secure boot, key and vault management, and anti-tamper capabilities—standard requirements for machine-to- machine communication and industrial IoT applications.

For complete graphics acceleration and video compression/decompression, the new device incorporates an ARM Mali-400MP dedicated graphics processor as well as a H.265 video codec unit, combined with support for Displayport, MIPI and HDMI. Finally, dedicated platform and power management unit (PMU) has been added that supports system monitoring, system management and dynamic power gating To see the latest Zynq UltraScale+ MPSoC technology demonstrations, visit the Xilinx Stand 1-205 at Embedded World , February 24-26, at the Nuremburg Exhibition Hall in Nuremburg, Germany.

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